- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/405 - Securing in non-demountable manner, e.g. moulding, riveting
Patent holdings for IPC class H01R 13/405
Total number of patents in this class: 1263
10-year publication summary
76
|
93
|
122
|
157
|
155
|
118
|
97
|
106
|
101
|
42
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1034 |
144 |
Sumitomo Wiring Systems, Ltd. | 9367 |
89 |
Yazaki Corporation | 6282 |
73 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
51 |
Japan Aviation Electronics Industry, Limited | 1585 |
42 |
Sumitomo Electric Industries, Ltd. | 14131 |
30 |
Advanced Connectek Inc. | 338 |
29 |
AutoNetworks Technologies, Ltd. | 5809 |
28 |
Robert Bosch GmbH | 40953 |
24 |
Hirose Electric Co., Ltd. | 325 |
23 |
Molex, LLC | 1792 |
23 |
Lotes Co., Ltd. | 346 |
22 |
TE Connectivity Solutions GmbH | 2580 |
18 |
Apple Inc. | 50209 |
17 |
Cheng Uei Precision Industry Co., Ltd. | 636 |
17 |
Amphenol Corporation | 748 |
12 |
Guangdong Oppo Mobile Telecommunications Corp., Ltd. | 18739 |
10 |
Dongguan Luxshare Technologies Co., Ltd. | 191 |
10 |
Tyco Electronics (shanghai) Co. Ltd. | 759 |
9 |
Aptiv Technologies AG | 2097 |
9 |
Other owners | 583 |